| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Jingxin;
PCB Layers: 2 Layers;
PCB Assembly: Yes;
SMT: Yes;
DIP: Yes;
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Type: Rigid Circuit Board;
Dielectric: PTFE / Ceramic / Ultra-Thin Glass Fiber Cloth;
Material: PTFE / Ceramic / Ultra-Thin Glass Fiber Cloth;
Application: Cellular Base Station Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: PTFE / Ceramic / Ultra-Thin Glass Fiber Cloth;
Insulation Materials: PTFE / Ceramic / Ultra-Thin Glass Fiber Cloth;
Brand: Wangling;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Surface Finish: Enig 1u'';
Layers: 1-20 Layers;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: Hydrocarbon / Ceramic / Woven Glass;
Material: Hydrocarbon / Ceramic / Woven Glass;
Application: Commercial Airline Broadband Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enepig;
Base Material: Hydrocarbon / Ceramic / Woven Glass;
Insulation Materials: Hydrocarbon / Ceramic / Woven Glass;
Brand: Rogers;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Width Spacing: 0.015mm;
Minimum Line Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1 PCS;
Layers: 1-64;
Warranty: 2 Years;
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