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Shenzhen Electronics
US$1.00-4.00 / Piece
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What is Factory Immersion Gold PCB PCBA

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer's brand
  • Origin China
  • Layer up to 32 Layers
  • PCB Material Fr-4, Cem-1, Cem-3, Hight Tg,etc
  • PCB Type Rigid PCB, Flexible PCB, Rigid- Flexible PCB
  • PCB Shape Any Shape
  • Board Thickness 0.3mm-4mm
  • Max.Finished Board Size 500* 1200mm
  • Min.Drilled Hole Size 0.2mm
  • Min.Line Width 0.05mm(2mil)
  • Min.Line Spaceing 0.05mm(2mil)
  • Copper Thickness 1/20z, 10z, 20z, 30z
  • Hole Tolerance Pth:±0.076,Ntph: ±0.05
  • Certificate ISO9001, ISO14001, IATF 16949, Ipc-a-610
  • Placement Precision Qfp, Sop, Plcc, BGA
  • SMT Jointing Capability 1206, 0805, 0603, 0402, 0201
  • Test X-ray, Aoi, in-Circuit Test , Functional Test

Product Description

Company Profile Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the ...

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Shenzhen Electronics Comparison
Transaction Info
Price US$1.00-4.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.90-99.99 / PCS US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 PCS 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, Western Union
Quality Control
Product Certification ISO9001, ISO14001, IATF 16949, Ipc-a-610 - - - -
Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others - ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM ODM, OEM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg,etc;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 500* 1200mm;
Min.Drilled Hole Size: 0.2mm;
Min.Line Width: 0.05mm(2mil);
Min.Line Spaceing: 0.05mm(2mil);
Copper Thickness: 1/20z, 10z, 20z, 30z;
Hole Tolerance: Pth:±0.076,Ntph: ±0.05;
Placement Precision: Qfp, Sop, Plcc, BGA;
SMT Jointing Capability: 1206, 0805, 0603, 0402, 0201;
Test: X-ray, Aoi, in-Circuit Test , Functional Test;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Dielectric: Taconic RF-10;
Material: Ceramic Filled PTFE and Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Surface Finish: Immersion Gold;
Board Thickness: 3.2mm(Finished);
Layer Count: 2-Layer;
Solder Mask: Black(Top);
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier