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PCB Assembly
US$5.00-8.00 / Piece
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What is PCBA Hackrf One Board Assembly Manufacturing PCBA Layout

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$8.00

10-99 Pieces US$7.00

100-999 Pieces US$6.00

1,000+ Pieces US$5.00

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric CEM-3
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Customer's Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 49 x 42 x 36 Centimeters/Piece
  • Trademark JXpcba
  • Origin China
  • Test Aoi/Spi
  • Certification ISO 9001/14001
  • Inner Packing Vacuum
  • Outer Packing Carton

Product Description

About us Jingxin PCBA Electronic Technology Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. ...

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PCB Assembly Comparison
Transaction Info
Price US$5.00-8.00 / Piece US$1.80-7.86 / Piece US$8.59-8.62 / Piece US$0.12-0.19 / Piece US$1.25-2.48 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification ISO 9001/14001 - - - -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carton;
Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 Mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 Mm;
Min Line Width&Space: 0.15 Mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Fastline Rigid PCB Circuits Board;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf/Immersion Gold/Immersion Tin/;
Lead Time: 6-8 Working Days;
Test: Fly Probe Testing;
Max PCB Size: 1200*500mm;
Minimum Order: 1 PCS;
Min Board Thickness: Single and Double Sided Is 0.1mm;
Min Pad: +/-0.1mm(4mil);
Min Conductor Width: 0.05mm (2mil);
Min Conductor Spacing: 0.05mm (2mil);
Thickness of Copper Foil Wire: 8-240um (4oz);
Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Brand: Ca;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White;
Silksreen: Black;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4 and Polyimide;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier