| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
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Type: Motherboard PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4.Fr-1,Cem-1.Cem-3.Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Color: Green, Yellow, Black, White, Red, Blue;
Copper Thickness: 10z;
Min. Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Supplier Type: Manufacturer;
Min.Line Width: 0.15mm;
Board Thickness: 0.2mm-4mm;
Surface Finishing: HASL, Lead Free HASL;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Number of Layers: 2/4/6/8/12/14 or Custom;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Board Size: Custom;
PCB Cutting: Shear, V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/14 or Custom;
Copper Thickness: 0.5-6.0oz;
Selling Units: Single Item;
Min Trace/Gap: 0.075mm or 3mil;
Silk Screen: White,Black;
Board Size: Custom;
Silk Scre Enmin Line Width: 0.006or0.15mm;
Board Thickness: 0.2-4.0mm;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Modelnumber: 4-Layer Blue PCB;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Copper Thickness: 0.5-6.0oz;
Jumber of Layers: 2/4/6/8/12/Custom;
Min Trace/Gap: 0.075mm or 3mil;
PCB Cutting: Shear, V-Score, Tab-Routed;
Silk Scre Enmin Line Width: 0.006or0.15mm;
Board Thickness: 0.2-4.0mm;
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