| Specification |
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide or Polyester;
Insulation Materials: Epoxy Resin;
Model: Pi;
Brand: OEM;
Silkscreen Color: White/Green/Black/Red/Blue Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Surface Treatment: OSP;
Layer: Double Layer;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Xjy;
Solder Mask: White, Black, Red;
Silkscreen: White, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Certificates: UL, RoHS, SGS, ISO9001;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Solder Mask: White, Black, Red;
Silkscreen: White, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Min. Hole Size: 0.25mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Board Thickness: 1.6mm;
|
Type: Flexible Circuit Board;
Dielectric: Pi;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Fr4;
Copper Thickness: 1oz;
Surface Finishing: Lf-Hal;
Solder Mask Type: Black;
Board Thickness: 1.0mm;
Min. Hole Size: 0.2mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Fr4;
Copper Thickness: 1oz;
Surface Finishing: Lf-Hal;
Solder Mask Type: Black;
Board Thickness: 1.0mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
