| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4, Cem1, Cem3 etc.;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Jt;
Thickness: 1.6mm, 1.2mm, 1.0mm, 0.8mm;
Copper: 1oz, 2oz, 3oz, 35um, 70um;
Surface Finish: OSP, HASL, HASL Lf;
Soldermask: White, Black, Green, Blue, Yellow;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Lamp/ LED/ Light;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Abis;
Layer: 1-2 Layers;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/ Silkscreen: Custom;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Used: LED Lighting;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP, Hal Lf;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ&Zapon;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
|