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High-Performance Server
US$650.00-23,500.00 / Piece
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What is High-Performance D Ell EMC Poweredge R350 Rack Server System with Xeon E-2300

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-98 Pieces US$23,500.00

99-298 Pieces US$1,200.00

299+ Pieces US$650.00

Sepcifications

  • Application Enterprise Level
  • Instruction System CISC
  • Max. CPUs 1
  • Number of CPu Threads 4
  • Server Form Factor 1U
  • Storage Capacity 500-1000GB
  • Supporting Memory Capacity 16GB
  • System Architecture X86 Server
  • Form Factor 1U
  • Management Interface iDRAC
  • Network Connectivity 1GbE
  • Operating System Windows Server
  • Power Supply Single PSU
  • Processor Type Intel Xeon
  • RAM Capacity 16GB
  • Storage Type HDD
  • Transport Package Cartons
  • Specification 482×598.94×42.8mm
  • Trademark D ell
  • Origin Beijing, China
  • Processor in Tel Xeon E-2300 Series Processor
  • Memory 4 DDR4 DIMM 3200mt/S
  • RAID Controllers Perc H355, Perc H355f
  • Hard Disks 4 X 3.5-Inch Sas/SATA (HDD/SSD)
  • Power Supplies 600W

Product Description

Product Description Processor One In tel Xeon E-2300 series processor with up to 8 cores or one In tel Pentium processor with up to 2 cores Memory ? Four DDR4 DIMM slots, supports UDIMM 128 GB max, speeds up to 3200 MT/s ? Supports unregistered ECC DDR4 DIMMs only NOTE: For Pentium processor, ...

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High-Performance Server Comparison
Transaction Info
Price US$650.00-23,500.00 / Piece US$699.00-1,699.00 / Piece US$1,200.00-2,500.00 / Piece US$800.00-1,800.00 / Piece US$1,799.00-3,899.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P LC, T/T, D/P LC, T/T, D/P LC, T/T, D/P
Quality Control
Management System Certification - Others Others Others Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Application: Enterprise Level;
Instruction System: CISC;
Max. CPUs: 1;
Number of CPu Threads: 4;
Server Form Factor: 1U;
Storage Capacity: 500-1000GB;
Supporting Memory Capacity: 16GB;
System Architecture: X86 Server;
Form Factor: 1U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Single PSU;
Processor Type: Intel Xeon;
RAM Capacity: 16GB;
Storage Type: HDD;
Processor: in Tel Xeon E-2300 Series Processor;
Memory: 4 DDR4 DIMM 3200mt/S;
RAID Controllers: Perc H355, Perc H355f;
Hard Disks: 4 X 3.5-Inch Sas/SATA (HDD/SSD);
Power Supplies: 600W;
Application: Enterprise Level;
Instruction System: CISC;
Max. CPUs: 1;
Server Form Factor: 2U;
Storage Capacity: >1TB;
Supporting Memory Capacity: >1TB;
System Architecture: X86 Server;
Form Factor: 2U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Intel Xeon;
RAM Capacity: Optional;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Processor: One 4th Generation AMD Epyc 9004 Series Processor;
Memory: 12 DDR5 DIMM Slots 3 Tb Max up to 4800 Mt/S;
Drive Bays: up to 24 X 2.5-Inch or 32 X Edsff E3.S Gen5 Nvme;
Power Supplies: 700/800/1100/1400/1800/2400W Hot Swap Redundant;
Cooling Options: Air Cooling;
Embedded Nic: 2 X 1 Gbe Lom Card (Optional);
Network Options: 1 X Ocp Card 3.0 (Optional);
GPU Options: up to 3 X 300W Dw or 6 X 75W Sw;
Pcie: up to Eight Pcie Slots;
Fans: up to 6 Hot Plug Fans;
Application: Enterprise Level;
Instruction System: CISC;
Max. CPUs: 1;
Server Form Factor: 2U;
Storage Capacity: >1TB;
Supporting Memory Capacity: >1TB;
System Architecture: X86 Server;
Form Factor: 2U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Intel Xeon;
RAM Capacity: Optional;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Processor: One 4th Generation AMD Epyc 9004 Series Processor;
Memory: 12 DDR5 DIMM Slots 3 Tb Max up to 4800 Mt/S;
Drive Bays: up to 24 X 2.5-Inch or 32 X Edsff E3.S Gen5 Nvme;
Power Supplies: 700/800/1100/1400/1800/2400W Hot Swap Redundant;
Cooling Options: Air Cooling;
Embedded Nic: 2 X 1 Gbe Lom Card (Optional);
Network Options: 1 X Ocp Card 3.0 (Optional);
GPU Options: up to 3 X 300W Dw or 6 X 75W Sw;
Pcie: up to Eight Pcie Slots;
Fans: up to 6 Hot Plug Fans;
Application: Enterprise Level;
Instruction System: CISC;
Max. CPUs: 1;
Server Form Factor: 2U;
Storage Capacity: >1TB;
Supporting Memory Capacity: >1TB;
System Architecture: X86 Server;
Form Factor: 2U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Intel Xeon;
RAM Capacity: Optional;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Processor: One 4th Generation AMD Epyc 9004 Series Processor;
Memory: 12 DDR5 DIMM Slots 3 Tb Max up to 4800 Mt/S;
Drive Bays: up to 24 X 2.5-Inch or 32 X Edsff E3.S Gen5 Nvme;
Power Supplies: 700/800/1100/1400/1800/2400W Hot Swap Redundant;
Cooling Options: Air Cooling;
Embedded Nic: 2 X 1 Gbe Lom Card (Optional);
Network Options: 1 X Ocp Card 3.0 (Optional);
GPU Options: up to 3 X 300W Dw or 6 X 75W Sw;
Pcie: up to Eight Pcie Slots;
Fans: up to 6 Hot Plug Fans;
Application: Enterprise Level;
Instruction System: CISC;
Max. CPUs: 1;
Server Form Factor: 2U;
Storage Capacity: >1TB;
Supporting Memory Capacity: >1TB;
System Architecture: X86 Server;
Form Factor: 2U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Intel Xeon;
RAM Capacity: Optional;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Processor: One 4th Generation AMD Epyc 9004 Series Processor;
Memory: 12 DDR5 DIMM Slots 3 Tb Max up to 4800 Mt/S;
Drive Bays: up to 24 X 2.5-Inch or 32 X Edsff E3.S Gen5 Nvme;
Power Supplies: 700/800/1100/1400/1800/2400W Hot Swap Redundant;
Cooling Options: Air Cooling;
Embedded Nic: 2 X 1 Gbe Lom Card (Optional);
Network Options: 1 X Ocp Card 3.0 (Optional);
GPU Options: up to 3 X 300W Dw or 6 X 75W Sw;
Pcie: up to Eight Pcie Slots;
Fans: up to 6 Hot Plug Fans;
Supplier Name

Beijing Jiuyun Technology Co., Ltd

Gold Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier