| Specification |
Function Type: Infrared Range and Communication System;
Detection Type: Photon Detector;
Output Signal Type: Analog Type;
Production Process: SemiConductor Integrated;
Material: Metal;
IP Rating: IP65;
Customized: Customized;
Protection Level: IP65(NEMA-4);
Emissivity: 0.95 Fixed;
Cable Length: 1.5m Standard (Extendable);
Power Supply: 24VDC;
Maximum Current: 20mA;
Spectral Range: 1.00μm;
Optical Resolution: 100:1;
Ambient Temperature: 0~60℃;
Relative Humidity: 10-95%(No Condensation);
Output Signal: 4~20mA;
Temperature Range: 300~800, 400~1200, 500~1400, 7~1700;
Response Time: 50ms Optional;
Measurement Accuracy: ±1% or ±1°C;
Repeat Accuracy: ±5% or ±5℃;
Size: M18*138mm;
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Function Type: Infrared Range and Communication System, Thermal Imaging System, Search and Tracking System;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Insb, Hgcdte;
Customized: Non-Customized;
Spectral Range: 3.7~4.8um;
Resolution: 1280*1024;
Pixel Pitch: 12um;
Netd: <20mk@25degree;
Frame Rate: 25Hz/50Hz/60Hz/100Hz;
Sync: Internal/External Sync;
Warranty: 1 Year;
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Function Type: Infrared Range and Communication System, Thermal Imaging System, Search and Tracking System;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Mct;
Customized: Non-Customized;
Spectral Range: 3.7~4.8um;
Resolution: 640*512;
Pixel Pitch: 15um;
Video Output: PAL/NTSC/Cameralink/Gige;
Warranty: 1 Year;
Weight: 9.5kg;
Type: Cooled Thermal Core;
Cooling Time: <8m;
Detector Material: Mct;
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Function Type: Thermal Imaging System;
Detection Type: Heat Detectors;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Semiconductor Material;
Customized: Customized;
Detector: Hgcdte;
Resolution: 1280*1024;
Pixel Pitch: 12μm;
Cooling Temperature: -20℃, -40℃;
Interface: SDI/Cameralink;
Cooling Mode: Sterling;
Operating Temperature: -40℃+70℃;
Zoom Mode: Electricity-Driven;
Power Consumption: 30W;
Input Voltage: DC 20V;
Wavelength Range: 3.7μm-4.8μm;
Dimensions: 151mm×90mm×90mm;
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Function Type: Thermal Imaging System;
Detection Type: Microbolometer;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Semiconductor Material;
Customized: Non-Customized;
Detector Type: Ingaas Focal Plane;
Spectral Range: 0.9-1.7μm;
Resolution: 640*512;
Pixel Pitch: 15μm;
Cooling Temperature: -20℃, -40℃;
Weight: 200g( Modules);
Interface: SDI/Cameralink;
Power Supply: DC 12V;
Power Consumption: ≤5W@25℃;
Operating Temperature: -40℃+70℃;
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