| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Dimensions of Components: 01005 (Imperal)/0402 (Metric);
The Spacing of Components: The Minimum Spacing for IC Is 0.25mm, The Minimum;
The Minimum Spacing for IC Is 0.25mm, Th: up to 30mm;
Accuracy of The Patch: Chip: ±25μm, IC: Class ±30μm;
The Ability to Patch: 104300 Points/H;
PCBA Equipment: First Article Inspection;
Automated Optical Inspection: Solder Paste Inspection;
Automatic Screen Printer: Laser Marking Machine;
Laser Cutting Machine: Nitrogen Reflow Welding Furnace;
Available Components: Connector;
Active Components: Passive Components;
Discretes: Memory Chip;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 1.5mm;
Metal Core PCB: T2 High Conductivity Copper(1.5mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 150°C;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-2;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Snt;
Type: Rigid Circuit Board;
Dielectric: Fr-2;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Snt;
Usage: Playback Switch, Disconnector, Change-Over Switch, Control Switch;
Number of Switch: Multi Control Switch;
Structure: PCB;
Contact Type: FPC Terminal Connector;
Detection Method: Circuit Function Testing Equipment;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Pantone, Ral, Cmyk;
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