| Specification |
Metal Coating: 1;
Mode of Production: 1;
Layers: 1;
Base Material: 1;
Customized: 1;
Condition: 1;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr-4;
Customized: Non-Customized;
Condition: New;
Type: Auto Fasteners;
Material: Steel;
Muffler Type: Rear Muffler;
Deck: Single;
Composition: Hardware;
Property: High and Low Temperature Lubricating Oil;
Shape: Solid;
Application: Machine;
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Metal Coating: Gold;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA Service Mode: Full Turnkey, Kitted Assembl etc;
BGA Minimum Ball Pitch: 0.4mm, 0.5mm, 0.65mm, 0.8mm, >0.8mm;
Supported IC Packages: Qfn, Qfp, BGA, Micro-BGA, Sop, Soic, to-220;
Stencil Thickness: 0.1mm, 0.12mm, 0.15mm, Customized;
Aoi Optical Inspection: 100% Aoi Inspection, Spot-Check Aoi;
Ipc-a-610 Compliance: Ipc-a-610 Class 2, Ipc-a-610 Class3;
Application Field: Medical Device, Automotive, Power Supply, IoT;
Conformal Coating Thickness: 25-50μm, 50-75μm, Customer Specified Thickness;
MOQ: No MOQ;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Copper Thickness: 0.5-12 Oz, Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Special PCB Technology: Blind & Buried Vias; HDI; Flex PCB; Rigid-Flex etc;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Running Speed: 20-40m/Min;
Stopping Accuracy: ±5mm;
Runtime: 10h;
Standby Time: 100h;
Cargo Platform Dimensions: 700*500*50mm;
Battery Type: 29.2V 30ah;
Charging Time: 5h;
Weight: 60kg;
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Metal Coating: Gold;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA Service Mode: Full Turnkey, Kitted Assembl etc;
BGA Minimum Ball Pitch: 0.4mm, 0.5mm, 0.65mm, 0.8mm, >0.8mm;
Supported IC Packages: Qfn, Qfp, BGA, Micro-BGA, Sop, Soic, to-220;
Stencil Thickness: 0.1mm, 0.12mm, 0.15mm, Customized;
Aoi Optical Inspection: 100% Aoi Inspection, Spot-Check Aoi;
Ipc-a-610 Compliance: Ipc-a-610 Class 2, Ipc-a-610 Class3;
Application Field: Medical Device, Automotive, Power Supply, IoT;
Conformal Coating Thickness: 25-50μm, 50-75μm, Customer Specified Thickness;
MOQ: No MOQ;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Copper Thickness: 0.5-12 Oz, Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Special PCB Technology: Blind & Buried Vias; HDI; Flex PCB; Rigid-Flex etc;
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