| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 2oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Space: 0.075mm;
Min. Line Width: 0.075mm;
Solder Mask: Green;
Test: Aoi;
Package: Vacuum Package;
Small Order: Accept;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 2.0mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Green Solder Mask: Green;
Surface Finish: HASL-Lead Free;
Board Thickness: 1mm;
Min Hole Size: 0.6mm;
Min Line Width: 4mil;
Min Line Spacing: 4mil;
Surface Finishing: Hal, Immersion Gold, Ect;
Package: Vacuum;
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Type: Rigid Circuit Board;
Dielectric: CEM-1;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: HASL;
Copper Thickness: 35um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Wigth: 0.075mm;
Min. Line Spacing: 0.075mm;
Layer: 1 to 18;
Package: Vacuum;
Shipping: UPS, FedEx, DHL, Ect;
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