| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: OEM;
Copper Thickness: 0.5-12 Oz, Customized;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Application Industries: Communications, Industrial Control, Semiconductors;
Board Thickness: 0.2-6.0 mm, Customized;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB etc;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
MOQ: No MOQ;
E-Test Coverage: 100% Electrical Test, Partial Test;
Aoi Inspection: 100% Aoi, Spot Check;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
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Type: Rigid Circuit Board;
Dielectric: Aluminum Base Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Brand: Abis;
PCB Material: Alu;
Layer: 2;
Impedance Control: No;
Buried& Blind Vias: No;
Copper: 35um;
Hard Gold: N/a;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 8mil;
Min Drill: 0.25mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 8mil;
Min Drill: 0.25mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Raw Material: Fr-4, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thick: 1.5mm;
Copper Thick: 2oz;
Quick Turn for 2layer: 24hours;
Minimum Space/Line: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, Gold Finger;
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