| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: OEM;
Copper Thickness: 0.5-12 Oz, Customized;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Application Industries: Communications, Industrial Control, Semiconductors;
Board Thickness: 0.2-6.0 mm, Customized;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB etc;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
MOQ: No MOQ;
E-Test Coverage: 100% Electrical Test, Partial Test;
Aoi Inspection: 100% Aoi, Spot Check;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
|
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Supplier Type: PCBA Assembly Manufacturer;
Application: Electronics Device/Home Appliances;
Copper Thickness: 2 Oz;
Service: One-Stop Turnkey;
Testing Service: Aoi X-ray Function Test;
Board Thickness: 0.2mm-7.0mm;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
Place of Origin: Guangdong, China;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
Surface Treatment: Gold Finger/Hard Gold;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
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