| Specification |
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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