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Innovative PCB Board
US$0.80-2.60 / Piece
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What is Innovative Copper PCB Board for Reliable Ai Computing Performance

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.80-2.60 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Flame Retardant Properties Customized
  • Dielectric MCPCB\Fr4\Bt
  • Base Material Double-Sided/Multilayer Aluminum/Copper
  • Insulation Materials Customized
  • Processing Technology Delay Pressure Foil
  • Application New Energy Vehicle Electronic Control Board
  • Mechanical Rigid Rigid
  • Material Aluminum
  • Brand Hongyu
  • Transport Package Sea/Land/Air Freight
  • Specification customized
  • Trademark hongyu
  • Origin Jiangxi, China
  • Board Thickness 1.6mm
  • Metal Core PCB Aluminum 5052 Core (1, 6mm)
  • Thermal Conductivity 3W/M·K (Dielectric Layer)
  • Copper Foil 70μm
  • Tg 150°C

Product Description

Product Description Specification NO. Project Conventional process capability Extreme process capability advantage 1 layer 1-10 10 2 Product Type MCPCB\FR4\BT MCPCB\FR4\BT * 3 Surface Treatment HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin (Sn)/Gold Plating HASL/OSP/ENIG/Immersion Silver ...

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Innovative PCB Board Comparison
Transaction Info
Price US$0.80-2.60 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece US$0.10 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, Western Union T/T T/T T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification - - - - UL, RoHS, SGS, ISO 9001, Ect
Management System Certification ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, Others ISO14001, Others ISO14001, Others -
Trade Capacity
Export Markets Southeast Asia/ Mideast, Domestic North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1, 6mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 0.2-4.0mm;
Copper Thickness: 1oz to 5 Oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.15mm;
Min Line Spacing: 0.15mm;
Layer: 1 to 18;
Supplier Name

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier