| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-1;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jxpcba;
PCB Type: Electronic PCB Assembly;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Size: Custom;
Surface Treatment: HASL Lead Free;
Stencil: We Do;
Service: One Stop;
Componnets: We Purchase or Buy by Yourselt;
Samll Order: Accepted;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
PCB Type: Electronic PCB Assembly;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Size: Custom;
Surface Treatment: HASL Lead Free;
Stencil: We Do;
Service: One Stop;
Componnets: We Purchase or Buy by Yourselt;
Samll Order: Accepted;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Black;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Black;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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