| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
PCB Layer: 1-26 Layers;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: Accepted;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 12-20 Days;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 6 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Material: Fr4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Business Type: Costomized;
Package: Vacuum Packaging;
Llead-Time: 3-5;
Supplier: Manufactory;
Sm Lines: 12 Lines;
Finish: Enig/Sliver/Golden;
Lead Time: 6-8 Days;
Quality: 100% Test;
Silk Screen: Red/ Blue/Green;
Thickness: 1 Oz/2oz/8oz;
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Type: Rigid Circuit Board;
Dielectric: Fr4+Pi;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid +Flex;
Processing Technology: Electrolytic Foil;
Base Material: Fr4+Pi;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr4+Pi;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Product Name: PCB Manufacturer Immersion Gold 8L Rigid Flex PCB;
Package: Carton + Vacuum;
Small Order: 1 PCS;
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