| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Rogers;
Base Material: Rogers;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Rogers;
Board Thickness: 0.8 mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Board Material: Rogers;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Board Thickness: 1.6mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Black;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacumm;
Lead Time: 5-7 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Board Material: Copper;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Black;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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