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Advanced PCB Solutions
US$0.30-4.50 / pieces

Cutting-Edge Rogers PCB Solutions for Advanced Wireless Applications Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 pieces US$4.50

100-999 pieces US$1.00

1,000+ pieces US$0.30

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material FR-4
  • Certification RoHS
  • Customized Customized
  • Condition New
  • Transport Package Box Packing
  • Specification standard size
  • Trademark GW
  • Origin Guangdong, China
  • Product Name PCBA PCB Assembly
  • Type OEM ODM
  • Assembly Process SMT DIP Mixed Technology
  • Surface Finish HASL Enig OSP Immersion Silver Gold Plating
  • Solder Type Lead-Free with Lead RoHS Compliant
  • Testing Methods Aoi Ict X-ray Functional Test

Product Description

Our Services Pcb Assembly Capability Single and double sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Min Chips size 01005 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) ...

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Advanced PCB Solutions Comparison
Transaction Info
Price US$0.30-4.50 / pieces US$0.01 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece
Min Order 1 pieces 1 Piece 10 Pieces 10 Pieces 10 Pieces
Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification RoHS RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America North America North America
Annual Export Revenue 20,000,000 RMB - - - -
Business Model ODM, OEM - ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: PCBA PCB Assembly;
Type: OEM ODM;
Assembly Process: SMT DIP Mixed Technology;
Surface Finish: HASL Enig OSP Immersion Silver Gold Plating;
Solder Type: Lead-Free with Lead RoHS Compliant;
Testing Methods: Aoi Ict X-ray Functional Test;
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Supplier Name

Guangdong Global Well Electronic Limited

Diamond Member Audited Supplier

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier