| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Produuct Name: Heat Pump Control Board;
Application: Commercial Heat Pump Machine;
Power Supply: 380 or 220±10%(VAC), 50/60Hz;
Sensor Type: Ntc(5KΩ/25°c,B Value 3470K);
Measuring Range: -30°c~99°c;
Controlling Range: -30°c~80°c;
Control Mode: Heating , Cooling;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 3kw;
Rated Voltage: Single Phase AC220V;
Heat-Dissipating Method: Air Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Alpcb;
Customized: Customized;
Condition: New;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Brand: Customers Brand;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-3.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
MOQ: 1PCS;
Surface Finishing: Enig, HASL, OSP;
Color: Red Blue Green Black White;
Testing Service: 100% Aoi Testing;
Heat Conduction: 2.0;
Color Temperature: 3000 Kelvin;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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