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Manufacturer Customized High Precision PCB

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Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

Dielectric FR-4
Transport Package Vacuum +Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark Fastline
Origin Shenzhen
Board Material Fr4
Board Layer 1
Board Thickness 0.2 mm
Copper Thickness 1 Oz
Solder Mask Yellow
Silkscreen White
Surface Finishing Enig
Lead Time 4-5 Working Days
Shipping Type DHL.TNT, EMS, FedEx, UPS etc
PCB Design Custom Design Product

Product Description

Manufacturer customized high precision PCB Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we take care of the entire process, including preparatio n of Printed Circuit Boards, procurement of components, ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Manufacturer Comparison

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Transaction Info
	Manufacturer Customized High Precision PCB Contact Now	Quick View Advanced Tcb Compatible Metallized Ceramic Heat Sink Electronic Ceramic Contact Now	Quick View Electronic Ceramic Precision Metallization with Gold Plating Finish Ceramic Heat Sink Contact Now	Quick View Reliable Amb Metallized Electronic Ceramic Heat Sink for Automotive Power Module Contact Now	Quick View Electronic Ceramic High Yield Metallization Ceramic Heat Sink with ISO9001 Contact Now
Price	Negotiable	US$2.88-5.88 / Piece	US$2.88-5.88 / Piece	US$2.88-5.88 / Piece	US$2.88-5.88 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal	LC, T/T, PayPal	LC, T/T, PayPal	LC, T/T, PayPal
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months
Product Attributes
Specification	Dielectric: FR-4; Board Material: Fr4; Board Layer: 1; Board Thickness: 0.2 mm; Copper Thickness: 1 Oz; Solder Mask: Yellow; Silkscreen: White; Surface Finishing: Enig; Lead Time: 4-5 Working Days; Shipping Type: DHL.TNT, EMS, FedEx, UPS etc; PCB Design: Custom Design Product;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;
Supplier Name	Fastline Circuits Co., Limited	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)
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Manufacturer Customized High Precision PCB

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