| Specification |
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow;
Silk Screen: White;
Material: Fr4 + Polymide;
PCB Type: Rigid-Flexible PCB;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Service: High Quality;
Dielectric: Fr-4;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: HB;
Application: Consumer Electronics;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Insulation Materials: Metal Composite Materials;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products;
Structure: Single-Sided Rigid Flex PCB;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products;
Structure: Single-Sided Rigid Flex PCB;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
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