| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: PP,Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Minimum Line/ Space: 0.075mm;
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Structure: Double-Sided Rigid PCB;
Dielectric: RO4533;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Subtractive Process;
Base Material: RO4533;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Dielectric Constant: 3.3;
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Structure: Multilayer Rigid PCB;
Dielectric: Rt Duroid 5880lz;
Material: Unique Filled PTFE Composites;
Application: Stripline and Microstrip;
Flame Retardant Properties: V0;
Processing Technology: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Production Process: Subtractive Process;
Base Material: Rt Duroid 5880lz;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 10mil 20mil 50mil and 100mil;
Layer Count: Single Sided, Double Sided, Multilayer PCB, Hybrid;
Dielectric Constant: 2;
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Structure: Multilayer Rigid PCB;
Dielectric: RO4533;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Subtractive Process;
Base Material: RO4533;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
Laminate Thickness: 20mil 30mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Dielectric Constant: 3.3;
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