| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Customized;
Product Name: HDI PCB Circuit Board;
Keywords: Printed Circuit Board;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 0-40;
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Type: Rigid-Flex Circuit Board;
Material: Fr4 + Polyimide;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 + Polyimide;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Rigid-Flexible PCB;
Keywords: Rigid Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Customized;
Product Name: HDI PCB Circuit Board;
Keywords: Printed Circuit Board;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 0-40;
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Application: Consumer Electronics / Industrial Control / Lot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid /Flex /Rigid-Fle;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Brand: Kq;
Layers: 1-32 Layers;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig /0sp /Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Solder Mask Color: Green /Black/White /Red/Blue /Yellow;
Customized: Customized;
Condition: New;
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