| Specification |
Structure: FPC;
Material: Polyester Film;
Combination Mode: Without Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Fastline;
Board Material: Polyimide;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Yellow;
Silk Screen: White;
PCB Type: Flexible PCB;
Test: 100%Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
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