| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 16 Layer;
Thickness Board: 2.0mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Surface Finishing: Lead-Free HASL;
Supply: Fast;
Testing: 100%;
Service: One-Stop;
File: PCB Gerber File;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
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Type: Multilayer PCB;
Dielectric: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Application: Consumer Electronics / Industrial Control / Lot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid /Flex /Rigid-Fle;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Organic Resin;
Brand: Kq;
Layers: 1-32 Layers;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig /0sp /Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Solder Mask Color: Green /Black/White /Red/Blue /Yellow;
Customized: Customized;
Condition: New;
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