| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4, Bt HDI;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 1200*500mm;
Min Hole Size: 0.075mm (3mil);
Min Conductor Spacing: 0.05mm (2mil);
Min Conductor Width: 0.05mm (2mil);
Surface Finishing: Enig, Immersion Gold, Immersion Tin, OSP;
Min Board Thickness: Single and Double Sized Is 0.1mm;
Min Pad: +/-0.1mm (4mil);
Lead Time: 4-5 Working Days;
Solder Mask: Any;
MOQ: 1 PCS;
Packing: Vacuum and Carton;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gol;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Comple;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB..etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Layer: 1-36 Layers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB..etc;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Service: PCB, Components Sourcing, Assembly, Tes;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Board Thickness: 0.2-8.0mm;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB;
Surface Finish: HASL/HASL Lead Free, Chemical Tin;
Copper Thickness: 0.5-100oz(18-3500um);
Service: PCB, Components Sourcing, Assembly, Test, Package;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Board Thickness: 0.2-8.0mm;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB;
Surface Finish: HASL/HASL Lead Free, Chemical Tin;
Copper Thickness: 0.5-100oz(18-3500um);
Service: PCB, Components Sourcing, Assembly, Test, Package;
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