| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Keyword: Custom PCB;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
One-Stop Service: PCB Assembly, Component Supply;
Price: Factory Price;
MOQ: 1 PCS;
Surface Finishing: Immersion Ni/Au;
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Spacing: 0.075mm(3mil);
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Testing Service: 100% E-Testing;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 2 to 14 Layers Flex Rigid PCB;
Material: Fr4, Pi;
Drawing: Gerber, .Pcbdoc;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flexible PCB;
Keywords: Rigid Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flexible PCB;
Keywords: Rigid Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flexible PCB;
Keywords: Rigid Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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