| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: No;
Brand: Exceeding;
Technology: Lead The Industry;
Surface Finish: Immersion Ni/Au;
Keyword: FPC;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Membrane;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Product Certificate: ASTM F963-16, CCC, FCC, CE, RoHS, SGS, Ect;
Company Certification: Universal Studios, Bandai, BV, OHSAS1;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Rear Adhesive: 3m467, 3m468, 3m9448A, 3m 9080, 3m 200, 3m 300;
Materials: PC/PVC/Pet/PCB/FPC/PMMA/Silicon;
Life Expectancy: 1, 000, 000 Actuations Per Switch Position;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Membrane;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Product Certificate: ASTM F963-16, CCC, FCC, CE, RoHS, SGS, Ect;
Company Certification: Universal Studios, Bandai, BV, OHSAS1;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Rear Adhesive: 3m467, 3m468, 3m9448A, 3m 9080, 3m 200, 3m 300;
Materials: PC/PVC/Pet/PCB/FPC/PMMA/Silicon;
Life Expectancy: 1, 000, 000 Actuations Per Switch Position;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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