| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics / IoT / New Energy;
Layers: 1-32 Layers;
Material: Fr-4/High Tg Fr-4/Aluminum/Ceramic/Copper/Hal;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig/0sp/Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness /Board Thickness: 0.50z/10z/20z/30z/40z;
Solder Mask Color: Green /Black/White /Red /Blue /Yellow;
Mechanical Rigid: Rigid/Flex/Rigid-Fle;
Condition: New;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics / IoT / New Energy;
Layers: 1-32 Layers;
Material: Fr-4/High Tg Fr-4/Aluminum/Ceramic/Copper/Hal;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig/0sp/Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness /Board Thickness: 0.50z/10z/20z/30z/40z;
Solder Mask Color: Green /Black/White /Red /Blue /Yellow;
Mechanical Rigid: Rigid/Flex/Rigid-Fle;
Condition: New;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Industrial Control;
Copper Foil Type: Electrolytic Copper Foil;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Conformal Coating: Optional;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Technical Service: Dfm Review, Technical Support;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Compliance Standard: Ipc a 610 Class 2 or Class 3;
Flame Retardant Grade: V0;
Number of Layers: 1 to 20 Layers;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics / IoT / New Energy;
Layers: 1-32 Layers;
Material: Fr-4/High Tg Fr-4/Aluminum/Ceramic/Copper/Hal;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig/0sp/Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness /Board Thickness: 0.50z/10z/20z/30z/40z;
Solder Mask Color: Green /Black/White /Red /Blue /Yellow;
Mechanical Rigid: Rigid/Flex/Rigid-Fle;
Condition: New;
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