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FPC
US$0.10-0.50 / Piece
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What is High-Quality Custom FPC Circuit Board Manufacturing with Reverse Engineering Capabilities

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.50 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Pi
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Cry
  • Transport Package Vacuum Packing
  • Specification ODM/OEM
  • Trademark CRY
  • Origin China

Product Description

Shenzhen Chengruyuan Technology Co., Ltd. is a dynamic high-tech printed circuit board (PCB) manufacturer based in Shenzhen, China. We specialize in multi-layer PCBs, metal rigid-flex boards, HDI, FPC, and SMT services, continuously expanding our capacity and technology to provide high-quality, ...

Learn More

FPC Comparison
Transaction Info
Price US$0.10-0.50 / Piece US$0.10-100.00 / piece US$0.10-0.50 / piece US$0.10-0.50 / piece US$0.10-100.00 / piece
Min Order 1 Piece 1 piece 1 piece 1 piece 1 piece
Payment Terms LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, LED;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Stiffener Thickness: 1.0mm;
Copper Thickness: 35um;
Surface Finish: HASL;
Solder Mask: Coverlay;
Legend: Without;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen, LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: Immersion Gold;
Solder Mask: Coverlay, Green;
Legend: Without;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Green;
Legend: White;
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Supplier Name

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier