| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Factory Price Power Bank Printed Circuit Board;
Name: Factory Price Power Bank Printed Circuit Board;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
MOQ: 10PCS;
Service: SMT DIP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyimide, Fiberglass Epoxy;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics;
Flame Retardant Properties: V0, V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Brand: Customized Brand;
Structure: Double-Sided FPC;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Inspection: Aoi Inspection;
Min Line Width / Spacing: 0.1/0.1mm;
Pattern Registration Tolerance: ±0.1mm (Working Panel Size: 250*300mm);
Min Pad Size: 0.2mm;
Coverlay Registration Tolerance: +/-0.15mm;
Solder Mask Registration Tolerance: +/-0.2mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: PCB Assembly;
Base Material: Fr4;
Insulation Materials: Solder Mask;
Board Material: Fr4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Layer: 1-26 Layers;
Usage: for Electronic Products;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 5-7 Days;
Packing Type: Carton + Vacuum;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Board Layer: 1 to 20 Layers;
Silk Screen Color: White;
Solder Mask: Green, Red, Blue, Black;
Surface Treatment: HASL Lead Free;
Material Type: Fr4;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Material Type: Fr4;
Copper Thickness: 1oz;
Board Material: Fr-4: Bt HDI;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Thickness of Coverlay: 25 Mil;
Number of Silkscreen: 2;
Inner Iayer Cu Thicknes: 35 Mil;
Color of Silkscreen: White;
Peeling Test of Coverlay: No Peelable;
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