| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Printed Circuit Board Double-Sided PCB Fabrication;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Printed Circuit Board Double-Sided PCB Fabrication;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm Or3mil;
Silk Scre En Min Line Width: 0.006or0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finish: Enig;
Overal Board Thickness: 2.0mm;
Min Hole: 0.1mm;
Board Thickness: 1.2mm;
Min Line Width/Space: 0.1/0.1mm;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Silkscreen: White, Black;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Number of Layers: 4-Layer;
Copper Thickness: 10z;
Product Name: Single Layer PCB or 1-24 Layers PCB;
Min. Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Solder Mask Color: White Black Yellow Green Red Blue Orange Purple;
Surface Treatment: HASL, Lf Haslimm Gold, Lmm Silverosp etc;
Min.Line Width: 0.15mm;
Board Thickness: 1.6mm;
Surface Finishing: Customized According to Customer Requirements;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Silkscreen: White, Black;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Number of Layers: 4-Layer;
Copper Thickness: 10z;
Product Name: Single Layer PCB or 1-24 Layers PCB;
Min. Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Solder Mask Color: White Black Yellow Green Red Blue Orange Purple;
Surface Treatment: HASL, Lf Haslimm Gold, Lmm Silverosp etc;
Min.Line Width: 0.15mm;
Board Thickness: 1.6mm;
Surface Finishing: Customized According to Customer Requirements;
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