| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Electronics Mainboard;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Type: Multilayer PCB;
Dielectric: Fr-4 / High-Tg Fr-4;
Material: Synthetic Fiber;
Application: Consumer Electronics / Industrial Control / Lot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid /Flex /Rigid-Fle;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Organic Resin;
Brand: Kq;
Layers: 1-32 Layers;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig /0sp /Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Solder Mask Color: Green /Black/White /Red/Blue /Yellow;
Condition: New;
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Type: Multilayer PCB;
Dielectric: Fr-4 / High-Tg Fr-4;
Material: Synthetic Fiber;
Application: Consumer Electronics / Industrial Control / Lot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid /Flex /Rigid-Fle;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Organic Resin;
Brand: Kq;
Layers: 1-32 Layers;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig /0sp /Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Solder Mask Color: Green /Black/White /Red/Blue /Yellow;
Condition: New;
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Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Operating System: OEM;
for: LED;
Board Thickness: 1mm;
Min. Hole Size: 0.2mm;
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Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Operating System: OEM;
for: LED;
Board Thickness: 1mm;
Min. Hole Size: 0.2mm;
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