| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mobile Phone Charger PCB Board USB Keyboard PCB P;
Item: Mobile Phone Charger PCB Board USB Keyboard PCB Pr;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Xjy;
Surface Finishing: Hf-HASL;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
Layer: 1 to 24;
Solder Mask: Green, Red, Blue, White, Yellow;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 0.3-3oz;
Layer: 1 to 22;
Min. Hole Size: 0.2mm;
Min. Line Space: 3mil;
Min. Line Width: 3mil;
Test: Aoi;
Surface Finishing: Enig;
Solder Mask Type: Green;
Package: Vacuum Package;
Wrap and Twist: 5%;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
PCB Board Thickness: 1.6mm;
PCB Solder Mask: Yellow;
PCB Silk Screen: White;
PCB Surfaceing: HASL;
Min Line: 0.16mm;
Min Hole Size: 0.2mm;
Min. Line Spacing: 0.12mm;
Min. Line Wigth: 0.2mm;
Pack: Vacuum Packing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: Enig;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Spacing: 0.15mm;
Min. Line Width: 0.15mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
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