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Android Phone PCB
US$1.00-20.00 / pcs

High-Quality Android Phone PCB Manufacturer PCBA Factory High-Performance PCBA Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9,999 pcs US$20.00

10,000+ pcs US$1.00

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Fr4 1.6mm PCB Android Phone PCB Android Phone PCB
  • Transport Package Vacuum Packing/Blister/Plastic /Cartoon
  • Specification CE, RohS, UL, SGS, ISO9001, 94v0
  • Trademark OEM/ODM
  • Origin Shenzhen, Guangdong
  • Item Fr4 1.6mm PCB Android Phone PCB Android Phone PCB
  • Layer 1-22
  • Surface Finishing HASL, Enig, OSP, Immersion Au, AG, Sn
  • Min.Hole Size 0.1mm
  • Min.Line Spacing 3 Mil
  • PCBA QC X-ray, Aoi Test, Function Test(100% Test)
  • Specialised LED, Medical, Industrial, Control Board
  • Delivery PCB, 7-10 Days;PCBA, 2-3weeks

Product Description

Company Profile Product Description Specification item value Model Number PCBA GPS GSM GPRS development board Type pcba Place of Origin China Guangdong Brand Name STHL PCB Assembly PCBA Supplier Type OEM PCBA Copper Thickness 0.5oz-6oz Copper Thickness 1/2OZ 1OZ 2OZ 3OZ Brand Name STHL PCBA Board ...

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Android Phone PCB Comparison
Transaction Info
Price US$1.00-20.00 / pcs US$0.10 / Piece US$0.01-0.02 / Piece US$0.10 / Piece US$0.099-0.20 / Piece
Min Order 1 pcs 100 Pieces 1 Piece 2 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS -
Management System Certification ISO14001, Others - - - -
Trade Capacity
Export Markets South America North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Item: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: No Brand;
Layer: 1 to 20;
Board Thickness: Board Thickness;
Finished Inner Copper Thickness: H/H0z-4/40z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Unice or OEM;
Layer: 1 to 20;
Mini Board Size: 8*8mm;
Max Board Size: 650*610mm;
Board Thickness: 0.3mm~3.5mm;
Finished Inner Copper Thickness: H/H0z-4/40z;
Finished Outer Copper Thickness: H/H0z-5/50z;
Min Hole Size: 0.2mm;
Surface Finishing: OSP, Immersion Gold, Gold Plating, Enig, Enepig;
Warranty: 1 Year;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr4,High Tg Fr4,Aluminum,Rogers,Cem-3,Cem-1 etc;
Insulation Materials: Epoxy Resin;
Product Name: Circuit Board;
Layer: 1~20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Min Board Size: 8*8mm;
Board Thickness: 0.3mm~3.5mm;
Max Board Size: 650*610mm;
Min Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver;
Min Line Width/Space: 2.5/2.5mil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Supplier Name

Shenzhen STHL Technology Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier