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Microwave PCB
US$0.90-99.99 / PCS
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What is Rogers Ad250c High Frequency RF and Microwave PCB Board for Electronics

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 PCS US$0.90-99.99 / PCS

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric Woven Glass Reinforced PTFE Antenna Grade Laminate
  • Material Woven Glass Reinforced PTFE Antenna Grade Laminate
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersion Gold
  • Base Material Woven Glass Reinforced PTFE Antenna Grade Laminate
  • Insulation Materials Woven Glass Reinforced PTFE Antenna Grade Laminate
  • Model PCB
  • Brand Rogers
  • Transport Package Vacuum Packing
  • Specification 90mm*90mm
  • Trademark bicheng
  • Origin Shenzhen China
  • Surface Finish Immersion Gold, 73.6%
  • Flamibility Rating 94V-0
  • Test 100% Electrical Test Prior Shipment
  • Service Area Worldwide, Globally

Product Description

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) General Description The Rogers AD250C RF and Microwave PCB is a double-layer high-frequency circuit board designed for demanding antenna and RF applications. Built on Rogers AD250C ...

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Microwave PCB Comparison
Transaction Info
Price US$0.90-99.99 / PCS US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 PCS 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: Woven Glass Reinforced PTFE Antenna Grade Laminate;
Material: Woven Glass Reinforced PTFE Antenna Grade Laminate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Woven Glass Reinforced PTFE Antenna Grade Laminate;
Insulation Materials: Woven Glass Reinforced PTFE Antenna Grade Laminate;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Gold, 73.6%;
Flamibility Rating: 94V-0;
Test: 100% Electrical Test Prior Shipment;
Service Area: Worldwide, Globally;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier