| Specification |
Type: Rigid Circuit Board;
Dielectric: RO3210 Laminate;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Materials: Fr4, Cem1-3, Aluminum/Copper-Based Materials;
PCB Type: Rigid HDI PCB, Flexible PCB, Rigid-Flexilbe PCB;
Max Size: 640*1100mm;
Layer: 1-32 Layers;
Board Thickness: 0.2mm-8.0mm;
Copper: 18um-210um(6oz);
Surface Treatment: HASL/OSP/Enig/ Immersion Gold/Golden Plated;
PCB Test: Ict Testing and Flying Probe Testing;
PCBA Test: Aoi, X-ray, Ate Test, Function Test, Aging Test;
Qualified: Ipc-a-610c;
Certificates: ISO9001/ISO13485/IATF16949/UL;
Service: PCB Production, Material Procurement, SMT Processi;
Software Supporting: Chip Decryption, Scm Development, Disassembly Modi;
PCB Layer: Rigid PCB up to 30 Layers, FPC up to 8 Layers, Rig;
Profiling Punching: Routing, V-Cut, Beveling, Chamfer;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi/X-ray;
Packing: Carton/Vacuum;
Delivery: 7-15 Days Sample;
|
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Ict/Fct;
Inner Packing: Vacuum;
Outer Packing: Carton;
|
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carton;
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