| Specification |
Type: Rigid Laminate;
Dielectric: PTFE Microwave Substrate;
Material: F4bm245;
Application: Base Station Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper,Electrodeposited Copper;
Base Material: F4bm245;
Insulation Materials: PTFE;
Brand: Wangling;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 16 Layer;
Thickness Board: 2.0mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Surface Finishing: Lead-Free HASL;
Supply: Fast;
Testing: 100%;
Service: One-Stop;
File: PCB Gerber File;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 16 Layer;
Thickness Board: 2.0mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Surface Finishing: Lead-Free HASL;
Supply: Fast;
Testing: 100%;
Service: One-Stop;
File: PCB Gerber File;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 0.5mm-3mm;
Copper Thickness: 0.5oz-8oz;
Material Type: Fr4;
Surface Treatment: Enig;
Solder Mask: Green;
Silk Screen Color: White;
Board Layer: 1-26 Layers;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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