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High Frequency PCB
US$0.90-99.99 / PCS
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What is 60mil Double-Layer Tmm4 RF Microwave PCB High Frequency PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$99.99

100+ PCS US$0.90

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric Tmm4
  • Material Ceramic, Hydrocarbon and Thermoset Polymer
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersion Gold
  • Base Material Tmm4
  • Insulation Materials Epoxy Resin
  • Model PCB
  • Brand Rogers
  • Transport Package Kk Paper, 3-Layer Wrinkle
  • Specification ≤ 400mm X 500mm
  • Trademark Bicheng
  • Origin Shenzhen China
  • Thickness 60mil
  • Application Antennas
  • Layer Count 2-Layer
  • Surface Finish Immersion Gold

Product Description

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 with Immersion Gold (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1.General Description This is a type of double layer RF PCB which is made on Rogers ...

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High Frequency PCB Comparison
Transaction Info
Price US$0.90-99.99 / PCS US$5.00-8.00 / Piece US$5.00-8.00 / Piece US$0.10-10.00 / Piece US$5.00-8.00 / Piece
Min Order 1 PCS 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union, Small-amount payment, VTB LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification - ISO 9001/14001 ISO 9001/14001 - ISO 9001/14001
Management System Certification - Others Others - Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM - Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: Tmm4;
Material: Ceramic, Hydrocarbon and Thermoset Polymer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Tmm4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 60mil;
Application: Antennas;
Layer Count: 2-Layer;
Surface Finish: Immersion Gold;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carton;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Ict/Fct;
Inner Packing: Vacuum;
Outer Packing: Carton;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carton;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier