| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Operation System: Linux;
Memory: 25n01gvze1g;
USB: Type-C;
Serial Port: I2c :1 Uart :3;
USB Interface: 1;
CTP Interface: 1;
Rgbrgb Interface": 1;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layer;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange, PU;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20,000,000 Points Per Day;
DIP Capability: 300,000 Points Per Day;
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