| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: White;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 1 Layer, 2 Layers, Custom;
Legend: Black;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ;
Board Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.2mm;
Thermal Conductivity: 1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K;
Ccl Brand: Jh, Ccaf.etc;
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Ceramic;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Ceramics;
Board Thickness: 1.6mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Test: Fly Probe Testing;
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Type: Rigid Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Fr4 + Polymide;
Base Material: Fr4 + Polymide;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fr4 + Polymide;
Brand: Fastline;
Board Material: Fr4 + Polymide;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: Yellow;
Lead Time: 5-7 Working Days;
Small Order: Accepted;
PCB Name: FPC Printed Circuit Board Rigid Flex PCB & PCBA;
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