| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Electronic&LED;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Xjy;
Silkscreen: White,Black,Red;
Solder Mask: Green,Yellow,Red,White,Black,Blue;
Surface Finishing: HASL,Lf-Hal,Immerion Tin,Immerion Gold,OSP;
Board Thickness: 0.2-4.0mm;
Copper Thickness: 10.5oz-4oz;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.2mm;
Surface Finish: Lf-Hal;
Package: Vacuum;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Andriod Pab Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White, Black, Green, Yellow;
Soldermask: White, Black, Green, Yellow;
Surface Finishing: HASL;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Board Thickness: 1.0mm;
Copper Thickness: 1oz;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Light;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.2mm;
Min.Hole Size: 0.3mm;
Min.Line Width: 0.2mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
Copper Thickness: 1oz;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Telecommunications;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Soldermask: Green;
Silkscreen: White;
Test: Flying Probe and Fixture;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Stencil Offer: Yes;
Impedence Control: Yes;
|
