| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
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Structure: FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics /Lot /New Energy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kq;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Quality Test: Aoi, 100% E-Test;
Condition: New;
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Structure: 1-12 Layer;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Flexible PCB Circuit Board;
Keywords: Flexible PCB;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.2mm±0.05mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Layer Count: 0-12;
|
Structure: 1-12 Layer;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Flexible PCB Circuit Board;
Keywords: Flexible PCB;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.2mm±0.05mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Layer Count: 0-12;
|
Structure: FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics /Lot /New Energy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kq;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Quality Test: Aoi, 100% E-Test;
Condition: New;
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