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Printed Circuit Board
US$0.10-80.00 / Piece
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What is Custom Multilayer 94V0 RoHS PCB, Blue Ink Printed Circuit Board Making

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Kb
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
  • Hole Buried/Blind Via, Via in Pad
  • Pth Wall 20um
  • Copper Thick 4oz

Product Description

Custom Multilayer 94V0 RoHS PCB,Blue Ink Printed Circuit Board Making ABIS CIRCUITS CO., LTD is a professional PCB manufacturer which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by ...

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Printed Circuit Board Comparison
Transaction Info
Price US$0.10-80.00 / Piece US$1.00-20.00 / Piece US$0.50-1.00 / Piece US$4.50-6.50 / Piece US$164.30 / Piece
Min Order 1 Piece 200 Pieces 10 Pieces 10 Pieces 2 Pieces
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 - - - -
Management System Certification - - - Others Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe North America, Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Hole: Buried/Blind Via, Via in Pad;
Pth Wall: 20um;
Copper Thick: 4oz;
Type: Aluminum PCB;
Material: Aluminum Covered Copper Foil Layer;
Application: Lighting;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Sunshineopto;
Copper Thickness: 10z;
Min.Hole Size: 0.2mm;
Min.Line Spacing: 0.1mm;
Min. Line Width: 0.1mm;
Base Materia: Aluminum;
Board Size: OEM;
Board Thickness: 1.6mm;
Single Package Size: 100X20X20cm;
Surface Finishing: HASL /Lead Free HASL for PCB Fabrication Factory;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Item: Core Development Board;
Model: Esp32-S3;
Chip: CH340K/CH343p;
Format: N8r2/N8r8/N16r8;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Banana Pi;
Item: Development Board;
Model: Banana Pi M7;
CPU: Rk3588;
RAM: 8GB/32GB;
Emmc: 64GB/128GB;
BLE: Bluetooth 5.2;
Network: Onboard WiFi 6;
Size: 92*62mm;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Sunshine Opto-Electronics Technology Ltd.

Gold Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Sunhokey Electronics Co., Ltd.

Gold Member Audited Supplier

Sunhokey Electronics Co., Ltd.

Gold Member Audited Supplier