| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control Module;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 6 Layers;
Thickness: 1.5mm;
Solder Mask: Green;
Legend: White;
Surface Finish: Enig;
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Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
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Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 0.2-6.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Roger;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Copper Thickness: 18um-3500um(0.5- 100oz);
Surface Finishing: Immersion Gold/Silver, HASL Lead Free, Gold Fing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 0.2-6.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, RO;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Copper Thickness: 18um-3500um(0.5- 100oz);
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lead Free;
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