| Specification |
Layer: 1-40 Layers;
Thickness: 0.2~8mm;
Copper Thikss: 1 Oz/2oz;
Use: Computer, Device, Telecommunication;
Surface Finishing: HASL,OSP,Lead Free HASL;
Min. Line Spacing: 0.003",0.15mm,0.05 mm;
Min. Hole Size: 0.25mm,0.1mm,6mil;
Solder Mask Color: Green Black Red,Black.Red.Yellow.White.Blue.Green;
Material: Fr4 Cem1 Cem3 Hight Tg,Fr4;
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Output Power: 200kVA;
Input Format: 3-Phase 4 Wires+Gnd;
Input Voltage: 3-Phase 380V±15%;
Input Frequency: 50Hz/60Hz;
Output Format: 3-Phase 4 Wires+Gnd;
Output Voltage: 0-520V;
Output Current-Low Grade: Customize;
Output Current-High Grade: Customize;
Output Frequency: 45-400Hz;
OEM: Support;
Size: Customize;
Weight: Customize;
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Thickness: 0.13, 0.15, 0.2;
Welding Techniques: Spot Welding, Vacuum Brazing;
Cell Size: 0.8-30mm;
Surface Treatment: Electroless Nickel Plating, Tin Plating, Powder Co;
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Type: Solid State PA;
Average Power: 10W~50W;
Frequency Range: 0.55g~8.0g;
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Type: Solid State PA;
Frenquency Range: 0.5-1.5g;
RF Output Power: 10W;
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