| Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-8 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Flexible PCB;
Keywords: Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.2mm-3.2mm ,Custom Available;
Copper Thickness: 0.5oz -4oz ,Customized Options;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-12L;
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Insulation Materials: Rogers 4250b + Pi;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid Flex PCB;
Keywords: Rigid Flex PCB for Aerospace Avionics;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-6.5mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24L;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flexible PCB;
Keywords: Rigid Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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Insulation Materials: Fr4+Pi;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flex PCB;
Keywords: Rigid-Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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