| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Material Brand: Shengyi;
Gold Thickness: 2u'';
Thickness: 2.0mm;
Solder Mask: Green;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Materials: Fr4/ Al/ FPC/ Cem-1/ Cem-3/ 94V0/ Rogers;
PCB Layer: 1-32 Layers;
PCB Thickness: 1.6mm-3.2mm/ 0.2mm-1.2mm;
Copper: 18um-210um(6oz);
Surface Treatment: HASL/ Enig/ Lf-Hal/ Immersion T;
Gerber File Format: .PCB / .P-CAD / .Dx;
Solder Mask: Green/White/Black/Red/Purple/ Blue/Brown;
Sample L/T: 5 to 7work Days;
Standare: Ipc-160-2;
Certificates: ISO9001, ISO13485, IATF16949;
MOQ: 1;
Component Range: 01005, BGA, Flip Chips, Connectors;
Quality Control: Fly-Probe Testing,Aoi, X-ray, Ict Testing;
EMS Service: PCB Design, PCB Clone, PCB Layout, PCB Assembly;
PCBA Packaging: Bubble Bag, ESD, Vacuum Packing;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Aluminum, FPCB, etc;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch* 22inch or 550mm* 550mm;
Min.Drilled Hole Size: 0.2mm;
Min.Line Width: 0.05mm(2mil);
Min.Line Spaceing: 0.05mm(2mil);
Surface Finishment: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 1/20z, 10z, 20z, 30z;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Inner Packing: Vacuum Packing, Plastic Bag;
Outer Packing: Standard Carton Packing;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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