| Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
|
Insulation Materials: Fr4+Pi;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flex PCB;
Keywords: Rigid-Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|
Insulation Materials: Fr4+Pi;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flex PCB;
Keywords: Rigid-Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|
Insulation Materials: Fr4+Pi;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flex PCB;
Keywords: Rigid-Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|
Insulation Materials: Fr4+Pi;
Flame Retardant Properties: V0;
Application: Communication;
Product Name: Rigid-Flex PCB;
Keywords: Rigid-Flex PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|